PAKCOOL^® TG-570-KJ is a next-generation high thermal conductive extrudable putty, developed based on the proven success of TG-560-KJ. While maintaining the original density of 3.50 g/cm³ and excellent rheological properties, the thermal conductivity has been enhanced from 6.0 W/m·K to 7.0 W/m·K, significantly improving heat dissipation efficiency to meet the thermal management requirements of higher power electronic components. With viscosity increased by only 0.5 million cP, the material still supports spreading, extrusion, and automated dispensing processes, delivering both high performance and ease of application.

Key Features

• Enhanced Thermal Conductivity: 7.0 W/m·K, improved by 1 W/m·K compared to the previous generation

• Stable Density: 3.50±0.30 g/cm³, ensuring balance between lightweight design and heat transfer efficiency

• Optimized Viscosity: Slight increase to 3.5±1.5 million cP, maintaining excellent dispensing and processing performance

• Non-curing & Reworkable: Easy disassembly and maintenance, reducing rework costs

• Automation Ready: Suitable for automated dispensing and large-scale production

• Superior Environmental Resistance: Excellent stability under high/low temperatures (-50~150℃), aging, weather, and dielectric conditions

• Safe & Environmentally Friendly: UL 94 V-0 flame retardant with low volatility