PAKCOOL® TG-560-GEL is a high-performance thermal gel with excellent adhesion and plasticity, designed for reliable thermal management in high-power applications. With a thermal conductivity of 6.0 W/m·K, it ensures rapid and efficient heat dissipation, extending the service life and reliability of electronic components. The material features high viscosity, strong thixotropy, and non-flowing behavior, making it easy to apply, extrude, or dispense automatically.

Key Features

• High Thermal Conductivity: 6.0 W/m·K for demanding power device cooling

• Low Stress & Low Modulus: Reduces mechanical stress on delicate components

• Stable & Reworkable: Excellent adhesion, non-curing, easy to rework

• Automation Compatible: Supports automated dispensing for mass production

• Durable & Reliable: Excellent resistance to temperature extremes (-50~200℃), vibration, aging, and weathering

• Safe & Environmentally Friendly: UL 94 V-0 flame retardant with low volatility