PAKCOOL® TC-9140 is a one-part, heat-curing liquid silicone adhesive with both thermal conductivity (4.0 W/m·K) and strong bonding capability. It provides excellent adhesion to copper, aluminum, stainless steel, and PCBs without releasing by-products during curing, making it suitable for large-area, deep, or fully enclosed bonding applications.

At elevated temperatures, TC-9140 cures rapidly, achieving 5.1 MPa bond strength in 10 minutes and up to 6.6 MPa in 30 minutes under 150℃, making it an excellent choice for reflow soldering and high-throughput assembly.

Key Features

• High Bond Strength: Up to 6.6 MPa (Al-Al lap shear at 150℃/30 min)

• Fast Curing: 10 minutes curing at 150℃ for quick processing

• Reflow Soldering Compatible: High-temperature resistance, no by-product release

• Wide Operating Range: -50~200℃ continuous use

• Electrical & Chemical Stability: High dielectric strength (8.5 kV/mm), excellent mechanical reliability

• Easy to Use: One-component design, no mixing required, suitable for automated dispensing