PAKCOOL® TC-9118-H is a one-part, heat-curing liquid silicone adhesive designed for applications requiring both efficient thermal management and exceptionally high bonding strength. With a thermal conductivity of 2.0 W/m·K and optimized viscosity (70,000 cP), it ensures excellent processability while delivering outstanding adhesion to copper, aluminum, stainless steel, and PCBs.

The “H” designation highlights its High Bonding capability: at 150℃, TC-9118-H achieves 3.8 MPa lap shear strength in just 5 minutes, and up to 6.1 MPa in 10 minutes, making it ideal for reflow soldering and high-throughput assembly processes.

Key Features

• High Bond Strength: 3.8 MPa (5 min) / 6.1 MPa (10 min) at 150℃

• Fast Curing: Rapid strength development suitable for reflow soldering

• Stable & Reliable: No by-products during curing, excellent adhesion on various substrates

• Wide Temperature Resistance: Continuous operation from -50 to +200℃

• Electrical & Mechanical Stability: Dielectric strength ≥10 kV/mm, strong chemical and mechanical reliability

• Easy to Use: One-component system, no mixing required, compatible with dispensing automation