Thermally Conductive Phase Change Material-卓尤

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Thermally Conductive Phase Change Material

PAKCOOL®

基本性能:

Excellent Thermal Conductivity – Thermal conductivity 3.0 W/m·K, effectively reducing interfacial thermal resistance.
Intelligent Phase-Change Compliance – Softens automatically at around 40–50 °C to fully fill micro-gaps between heat source and heatsink.
Excellent Interfacial Wettability – After phase change, the surface becomes tacky, ensuring intimate contact with both thermal surfaces.
Long-Term Reliability – Excellent resistance to pump-out, high & low temperature, and humidity aging.
Electrical Insulation & Safety – Electrically insulating formulation suitable for high-density electronic modules.
Process Versatility – Compatible with multiple assembly methods such as screen printing, die-cutting, and automated placement.

应用:

Ideal for active cooling devices and other electronic applications demanding low thermal resistance and long-term reliability.

PAKCOOL® Thermally Conductive Phase Change Pad Specification

P/N	Appearance	Thermal Conductivity（W/m·K）	Phase transition temperatu（℃）	Viscosity （cP）	Thermal Impedance @20psi （K-in²/W）	BLT（um）	Density （g/cm³）	Continuous use Temperature	File
PC-5430	White/Gray paste	＞3.0	44±2	200,000-400,000	≤0.01	15	2.80±0.10	-40 ~150℃	PC-5430

PAKCOOL®PC-54xx series is offered in a 1Kg, 5Kg and 20Kg barrel or 330mL, 55mL tube or customizable according to customer requirements.

PAKCOOL® Thermally Conductive Phase Change Pad Specification

P/N	Color	Thermal Conductivity（W/m·K）	Thermal Impedance @20psi,0.5mm （K-in²/W）	Thickness (mm)	Density (g/cm³)	Hardness @25℃（Shore OO）	Phase Transition Temperature（℃）	Volume Resistivity（Ω·cm）	Continuous use Temperature	File
PC-7630	Gray	3.0±0.1	0.34	0.3-5.0	2.95±0.05	50±10	42-52	≥2.0×10¹³	-40 ~150℃	PC-7630

PAKCOOL®PC-76xx Series Thermally Conductive Phase Change Pads are adhesive-free and can be cut to size according to customer requirements.

Operating Guide for PAKCOOL® Thermally Conductive Phase Change Paste

Operating Guide

1. Preparation and Storage Before Use: Thermally conductive grease can be stored at 2-8℃ for approximately 12 months. Before use, acclimate the product at 25°C for at least 4 hours to ensure the material reaches the ambient usage temperature.
2. Application Method and Process: The interface surfaces should be cleaned with alcohol to remove dust before thermal grease is applied on the surface.
During application, use a screen-printing process.After the material is applied between the component and the heat sink, it should be placed under appropriate drying conditions to cure into a solid phase-change layer, ensuring optimal thermal performance. For best results, the thinner the paste layer, the lower the interfacial thermal resistance, provided the interface gap is fully filled.

3. Unused Products: Any unused material should be tightly sealed for future use.

Typical Drying Conditions：For example, with a coating thickness of 0.025 mm (see table below) The below drying profile is a guideline recommendation. Conditions (time and temperature) may vary based on customer’s experience and their application requirements, as well as customer’s drying equipment, oven loading and actual oven temperatures.

Temperature	Time
25°C	48 h
70°C	60 min
150℃	10 min

Precautions

1. 1. This product is volatile; proper protection and well-ventilated usage environments are required.
2. 2. Viscosity varies with the temperature, it's recommended to use in constant temperature conditions.
3. 3. Please refer to the product's Material Safety Data Sheet (MSDS) for safety details.

Screen Printing Process

The table below illustrates how different mesh counts correspond to different coating thicknesses:

Mesh Count	Mesh Thickness(mm)	Coating Thickness(mm)
60	0.21	0.135~0.145
80	0.20	0.12~0.15
110	0.15	0.09~0.10

PAKCOOL® Thermal Conductive Phase Change Pad offers excellent stress-buffering capability

The hardness–temperature curve demonstrates that PAKCOOL® PC-7630 undergoes a distinct phase-change softening within its operating temperature range, where hardness drops sharply.
This behavior allows the material to soften automatically during device operation, conforming tightly to the interface and significantly reducing microscopic air gaps and contact thermal resistance.
Upon cooling, the material reverts to a solid state, maintaining dimensional stability and structural integrity without flowing or bleeding.
This reversible “softening on heating – solidifying on cooling” characteristic is the key distinction between phase-change pads and conventional elastomeric thermal pads

PAKCOOL® Thermally Conductive Phase Change Pad delivers ultra-low thermal resistance

The thermal resistance–pressure curve indicates that as pressure increases, the interface contact becomes more intimate, micro-voids are compressed, and thermal resistance decreases significantly.

PC-7630 maintains extremely low thermal resistance even under typical assembly pressures, demonstrating outstanding conformability and thermal performance.

This also highlights the product’s high compliance and excellent compression response, making it ideal for module clamping and pressure-mounted assembly processes.

根据客户需求，提供专业定制化服务。

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